二手松下貼片機(jī)MSR程序的構(gòu)成
程序的構(gòu)成：
1． PCB：OGR----SUPPORT PIN REMOVAL---PCB PROGRAM CREATION---自動調(diào)寬---REFERENCE PIN 調(diào)整（OPTION）---STOPPER ADJUSTMENT—SUPPORT PININSTALLATION—PCB TRANSFER
2． MARK LIBRARY
3． NC PROGRAM
4． PARTS LIBRARY
5． ARRAY PROGRAM
6． PROGRAM SELECTION
一． PCB PROGRAM的理解
二． MARK LIBRARY的理解
1．PCB MATERIAL CODE
| CODE | PCB MATERIAL | MARK MATERIAL | |
| 0 | PAPER PHENOL （基板是樹脂） | COPPER FOIL 銅箔 | |
| 1 | PAPER PHENOL （基板是樹脂） | SOLDER METAL PLATING（錫箔） | |
| 4 | CERAMIC （基板是陶瓷） | SILVER PALLADIUM PASTE（銀箔） | |
| 5 | CERAMIC （基板是陶瓷） | 銅箔 | |
| 6 | CERAMIC （基板是陶瓷） | GOLD PADTE（金箔） | |
2．REC TYPE
| | | |
| 0 | GRAY SCAL MARK（輝度） | |
| 1 | BINARY MARK（二值）用在氧化板上 | |
| 2 | DISTINCTION MARK（特殊MARK，一般不用，BAD MARK識別，用于拼版，其中一塊損傷情形） | |
2—DISTINCTION MARK
DISTINCTION MARK必須比框大，一般2MM*2MM以上
正負(fù)10百分—NORMAL；20百分—ROUGH；30百分—VERY ROUGH。
2．LIGHT：
| | MSR | MV2VB |
| 1 | SPREAD環(huán)射 | RING |
| 2 | DIRECT弱射 | SPOT |
| 3 | DIRECT+SPREAD環(huán)+弱 | RING+SPOT |
（三）、NC PROGRAM 的理解
*確定元件安裝順序時，應(yīng)注意以下幾點(diǎn)
1．按元件尺寸由小到大地貼裝。
2．為使Z軸移動較少，同一元件的尺寸應(yīng)集中貼裝。
3．盡量使X-Y TABLE少移動。
*程序指令優(yōu)先順序：
1．執(zhí)行（SR）語句
2．BAD MARK語句壞板標(biāo)記檢出指令
3．MARK 語句
4．貼裝語句
N C: ARRAY: PCB:
OFFSET X: Y: HM: MULTI ORG. BLOCKS: MARK LAND:
| BLOCK NO. | X | Y | Z NO. | S&R | THETA θ | SKIP | MT.HGHT | MRK | NO | MT.WAIT | GROUP | PROD | CMNT |
| 1 | 0 | 0 | 1 | 02 | 0 | 0 | 0 | 0 | 0 | 0 | | 0 | |
| 2 | -124.2 | 37.5 | 1 | 22 | 0 | 0 | 0 | 0 | 0 | 0 | | 0 | |
| 3 | | | | | | | | | | | | | |
| 4 | | | | | | | | | | | | | |
1．NC、ARRAY、PCB
2．OFFSET：X ： Y：
INPUT THE DIFFERENCE（DISTANCE）BETWEEN THE ORIGINAL POSITION OF THE PANASERT AND POSITIONS OF THE X AND Y COORDINATES ON THE PC BOARD。
指線路板上的坐標(biāo)原點(diǎn)與機(jī)器固有的機(jī)械原點(diǎn)之間的距離補(bǔ)償。
機(jī)械原點(diǎn)是固定值，坐標(biāo)原點(diǎn)因每個程序而異，可自由設(shè)定。
設(shè)置坐標(biāo)原點(diǎn)后，設(shè)置程序補(bǔ)償值。
*機(jī)器的原點(diǎn)到程序原點(diǎn)（機(jī)器貼裝頭）的距離。
MACHINE OFFSET值應(yīng)放在MACHINE DATA內(nèi)，但往往MACHINE DATA內(nèi)并未設(shè)置。
程序補(bǔ)償值因單臺設(shè)備而多少有些差異，設(shè)置補(bǔ)償值后，實(shí)際貼裝一個元件，直到修正無誤為止。
一般設(shè)置程序補(bǔ)償值以**個貼裝點(diǎn)為準(zhǔn)或MARK點(diǎn)為準(zhǔn)。
*背離電機(jī)：負(fù)
接近電機(jī)：正
*CAD數(shù)據(jù)+MACHINE OFFSET=生產(chǎn)坐標(biāo)
3．HM（X-Y T）：貼裝時等待高度。（前道工序已安裝元件的*高高度，設(shè)置該值，防止碰到
已安裝元件。
4．MULTI ORG：多重原點(diǎn)
MLTI ORG F=
默認(rèn)值是1
例:MULTI-ORIGIN=40
**** NO.2
| 1 | 2 | .. | | | | | 39 | 40 | 41 | 42 | ... | | | 75 |
因可根據(jù)不同程序指定，所以若將數(shù)種元件配置事先裝好后只需變更多重原點(diǎn)的指定，便可更換生產(chǎn)的品種。
5．BLOCKS：
6．MARK LAND：共有多少MARK（5、6機(jī)器會顯示，不可修改）
7．BLOCK：編號
8．X、Y：貼裝點(diǎn)的坐標(biāo)
X：右為正，左為負(fù)；
Y：里側(cè)為正，外側(cè)為負(fù)。
9．Z NO。：用哪一料站
| | 標(biāo)準(zhǔn)送料器（SINGLE） | DOUBLE |
| K型 | 21．5MM | 10．75MM |
| Q型 | 20．00MM | 10．00MM |
10.S&R:用兩列代碼指定連片逐點(diǎn)或連片逐片方式及貼裝圖案的旋轉(zhuǎn)角度。
| | 0 | 1(STEP REPEAT) | 2(PATTERN REPEAT) |
| 0(0度) | NORMAL MOUNTING NO ROTATION | | |
| 1(90度) | | STEP REPEAT 90度ROTATION | PATTERN REPEAT 90度ROTATION |
| 2(180度) | | STEP REPEAT 180度ROTATION | PATTERN REPEAT 180度ROTATION |
| 3(270度) | | STEP REPEAT 270度ROTATION | PATTERN REPEAT 270度ROTATION |
01—O度STEP REPEAT
11—90度STEP REPEAT
21—180度STEP REPEAT
31—270度STEP REPEAT
02—0度PATTERN REPEAT
12—90度PATTERN REPEAT
22—180度PATTERN REPEAT
32—270度PATTERN REPEAT
注：S&R的**個圖案的補(bǔ)償值（X、Y坐標(biāo)）必須輸入（0，0）
若語句1S&R寫22,貼裝出錯.
11．SKIP: 1)0:BLOCK IS EXECUTED
2)7:BLOCK IS NOT EXECUTED(無條件跳躍)
3)1-6,8,9有條件跳躍
注:如果**句被SKIP掉,機(jī)器會執(zhí)行”PASS-THROUGH”
12.THETA:貼裝角度：元件在PCB板上貼時的角度。
13．MT.HGH
T:貼裝高度補(bǔ)償(X-Y T補(bǔ)償)
14.MRK:
| MARK | FIDUCIAL | 0:NO MARK |
| 1:INDIVIDUAL MARK |
| 2:BOARD MARK |
| 3:PATTERN MARK(拼版) |
| 4:GROUP MARK |
| DISTINCT MARK | DISTINCT MARK(SENSOR) | 10:BAD MARK |
| 13:VARIETY SELECT MARK |
| DISTINCT MARK(CAMERA) | 20:BAD MARK |
| 23:VARIETY SELECT MARK |
15.NO:禁止貼裝判斷 0:進(jìn)行貼裝 1:禁止貼裝
16.MT.WAIT:貼裝等待0:正常貼裝
1:貼裝等待(一般是較高的元件,防止碰撞而放在*后貼裝)
17.GROUP(單獨(dú)使用):
18.PROD:(異種—針對混合類型,二者配合使用)
19.CMNT:注釋
EXAMPLE：普通陰陽板
| BLOCK NO. | X | Y | Z NO. | S&R | THETA θ | SKIP | MT.HGHT | MRK | NO | MT.WAIT | GROUP | PROD | CMNT |
| 1 | 0 | 0 | 1 | 02 | 0 | 0 | 0 | 0 | 0 | 0 | 0 | 0 | |
| 2 | 88.4 | 0 | 1 | 02 | 0 | 0 | 0 | 0 | 0 | 0 | 0 | 0 | |
| 3 | 0 | 0 | 1 | 0 | 0 | 0 | 0 | 23 | 0 | 0 | 0 | 1 | |
| 4 | 0 | 0 | 1 | 0 | 0 | 0 | 0 | 23 | 0 | 0 | 0 | 2 | |
| 5 | 0 | 0 | 1 | 0 | 0 | 0 | 0 | 4 | 0 | 0 | 1 | 0 | |
| 6 | 0 | 0 | 1 | 0 | 0 | 0 | 0 | 4 | 0 | 0 | 2 | 0 | |
| 7 | 43.35 | 77.36 | 1 | 0 | 0 | 0 | 0 | 0 | 0 | 0 | 1 | 1 | R1 |
| 8 | 48.38 | 74.77 | 2 | 0 | 90 | 0 | 0 | 0 | 0 | 0 | 1 | 1 | C1 |
| 9 | 96.5 | 69.80 | 3 | 0 | 0 | 0 | 0 | 0 | 0 | 0 | 2 | 2 | Q1 |
| 10 | 99.21 | 69.80 | 4 | 0 | 270 | 0 | 0 | 0 | 0 | 0 | 2 | 2 | Q2 |
| METHORD | CLASSIFICATIONG | TYPE | APPLICABLE PART |
| TRANSMISSIVE（BINARY）透射 | 1 | 0 | Square chip(standard) |
| 2 | 0 | Small transistor(standard) |
| 2 | 1 | Small transistor(part with marry burrs on the body) |
| 3 | 0 | Thin component(standard) |
| 3 | 1 | Thin component(part that looks as if it has a hole) |
| 4 | 0 | QFP,SOP(standard) |
| 6 | 0 | Large transisitor(standard) |
| 7 | 0 | Odd-shaped component(standard) |
| 8 | 0 | HEMT(standard) |
| 9 | 0 | Round component(standard) |
| 11 | 0 | Aluminum electrolytic capacitor(standard) |
| Reflective (Gray scale) 反射 | 13 | 0 | Air wound coil |
| 20 | 0 | Square chip resistor(strong against noise) |
| 20 | 1 | Square chip resistor |
| 20 | 3 | Square chip resistor(with upside down check) |
| 21 | 0 | Cylindrical chip resistor(standard) |
| 21 | 1 | Cylindrical chip resistor(when reflection is unstable) |
| 22 | 0 | Chip resistor network(with pickup check) |
| 22 | 1 | Chip resistor network(without pickup check) |
| 30 | 0 | Square chip capacitor(when nozzle glitters) |
| 30 | 1 | Square chip capacitor(standard) |
| 31 | 0 | Tantalum electrolytic capacitor(black) |
| 31 | 1 | Tantalum electrolytic capacitor(white) |
| 32 | 0 | Tantalum electrolytic capacitor(black) |
| 40 | 0 | Transistor(standard) |
| 40 | 1 | Transistor(with wide lead) |
| 40 | 5 | Transistor(with electrode which appears to be dark) |
| 41 | 0 | Mini power transistor(standard) |
| 42 | 0 | Large power transistor(standard) |
| 43 | 0 | Two-terminal diode(standard) |
| 44 | 0 | Light emitting diode |
| 44 | 1 | Light emitting diode(standing pickup check at both edge electrodes) |
| 44 | 2 | Light emitting diode(standing pickup check at the body center) |
| 48 | 0 | SOP |
| 50 | 0 | Unidirectional lead connector |
| 51 | 0 | 2-directional lead connector |
| Reflective (Gray scale) 反射 | 52 | 0 | SOP |
| 53 | 0 | QFP |
| 54 | 0 | SOJ |
| 55 | 0 | PLCC |
| 56 | 0 | Black BGA/CSP |
| 57 | 0 | LCC |
| 72 | 0 | Chip SAW filter(inclination determined by four sides) |
| 72 | 1 | Chip SAW filter(inclination determined by top/bottom sides) |
| 72 | 2 | Chip SAW filter(inclination determined by left/right sides) |
| 86 | 0 | Checker chip |
| 90 | 0 | White connector |
| 90 | 3 | Shield case |